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Industry

Snapdragon Summit 2026: Memory price burden could last for several quarters or longer

Qualcomm is looking for ways to reduce cost pressure on Snapdragon PCs as memory prices rise, as agentic AI on PCs requires a certain amount of DRAM and storage. Nitin Kumar, Qualcomm vice president of product management, said the outlook for memory prices is hard to predict and the burden could last for several quarters or longer. Qualcomm plans to broaden DRAM capacity and supplier options and optimise software with Microsoft and PC makers.

Industry

[Snapdragon Summit 2026] \"A chip like a racing engine... Move memory to the side to secure a heat-dissipation path\"

Qualcomm applied a new package design to the Snapdragon 8 Elite Extreme Gen 6 by moving memory to the side and creating a new path to dissipate heat, aiming to sustain high burst performance longer in top-end smartphones. Chris Patrick (크리스 패트릭) said keeping the SoC cool helps it stay at maximum performance longer. Qualcomm said handset makers may need minor cooling design changes and it is reviewing other packaging approaches.

Industry

Qualcomm says agentic AI devices underpin 6G demand, keeps 2029 commercialisation timeline

Qualcomm says agentic AI devices will underpin demand for 6G by creating connectivity needs different from smartphones, as on-device agents exchange inference between devices and the cloud. Durga Malladi said new device makers, including Alibaba, prioritise always-on cloud connectivity for inference over peak data rates. Qualcomm is preparing 6G around connectivity, wide-area sensing and network high-performance computing. It is keeping a 2029 commercialisation timeline and planning a 6G technology demonstration at the 2028 Los Angeles Olympics.