| Mobile Web

[Snapdragon Summit 2026] \"A chip like a racing engine... Move memory to the side to secure a heat-dissipation path\"

Qualcomm applied a new package design to the Snapdragon 8 Elite Extreme Gen 6 by moving memory to the side and creating a new path to dissipate heat, aiming to sustain high burst performance longer in top-end smartphones. Chris Patrick (크리스 패트릭) said keeping the SoC cool helps it stay at maximum performance longer. Qualcomm said handset makers may need minor cooling design changes and it is reviewing other packaging approaches.