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Industry
As AI chips grow, packaging substrates shift from round wafers to square panels
As AI chips grow in area, investment is starting at home and abroad to switch packaging bases from round wafers to large square substrates. Using square panels can process 5 to 6 times more chips at once than wafers, raising area utilisation to 87 percent from 57 percent. Competition is also intensifying between Taiwan and South Korean companies over panel-level packaging, a process that reassembles cut chips on a panel and builds moulding and redistribution layers.
Industry
Samsung foundry pins hopes on \'AI factory\' turnkey model to chase TSMC
Samsung Electronics is seeking a turnaround in its foundry business with an \"AI factory\" turnkey model that bundles memory, foundry and packaging. With TSMC\'s 3-nanometre utilisation near 100% and wafer price increases expected, some fabless chip designers are looking to reduce reliance on a single vendor. Samsung says demand for memory-and-foundry turnkey offerings is rising and that 2-nanometre contracts could become visible soon. The second half of the year will be a key test.
Industry
Samsung Electronics sees NAND, foundry join AI-driven profit engines
Samsung Electronics is seeing a shift in profit drivers in its memory business as NAND flash and its contract chipmaking unit gain traction on AI demand, following record quarterly results led by HBM and DRAM. The company says it has completed mass-production preparations for high-performance Gen6 NAND storage and received positive early customer feedback. It also says talks with multiple large AI HPC customers on its 2-nanometre process are active, with expectations of visible results soon.
