Industry
Samsung Electro-Mechanics, LG Innotek face off over next-generation substrates at KPCA
Samsung Electro-Mechanics and LG Innotek are unveiling new semiconductor package substrate technologies at KPCA Show 2026 in Incheon from Sept. 9 to 11. Samsung Electro-Mechanics is exhibiting five items including 2.5D and 2.1D package substrates, glass substrates and automotive FCBGA. LG Innotek is debuting an AI accelerator FC-BGA and plans mass production of high value-added FC-BGA for AI training and inference in 2027. Both are accelerating glass substrate development.
