Industry

As AI chips grow, packaging substrates shift from round wafers to square panels

As AI chips grow in area, investment is starting at home and abroad to switch packaging bases from round wafers to large square substrates. Using square panels can process 5 to 6 times more chips at once than wafers, raising area utilisation to 87 percent from 57 percent. Competition is also intensifying between Taiwan and South Korean companies over panel-level packaging, a process that reassembles cut chips on a panel and builds moulding and redistribution layers.

AI & Enterprise

Microsoft Edge automates extension reviews as AI coding drives submissions

Microsoft’s Edge team is automating parts of its extension review process after AI coding tools helped developers build and submit extensions faster, increasing review workloads. Microsoft said the surge has strained its review pipeline and extended processing times, and its fast-track process for high-quality extensions has hit limits. The company said it is introducing automation for repetitive checks and improving pipeline handling without reducing standards, and will shorten featured badge renewal cycles to 15 days.