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Industry

SK hynix unveils CPO technology to break memory bandwidth barrier

SK hynix presented a technology aimed at easing a new bottleneck in AI infrastructure in a paper published in the journal Nature Electronics. The company said ultra-large clusters linking thousands of GPUs and HBM are creating a bandwidth barrier that limits data movement between systems. The paper outlines a roadmap for co-packaged optics, with targets including more than 100 Tb/s per node and less than 1 pJ/bit energy use.

AI & Enterprise

South Korea, Italy discuss science and technology cooperation in AI, climate and bio

South Korea and Italy will expand science and technology cooperation centred on three areas: artificial intelligence, climate change and bio, South Korea\'s Ministry of Science and ICT said. The two countries held the 13th Korea-Italy Joint Committee on Science and Technology in Rome with Italy\'s Ministry of Foreign Affairs and International Cooperation. They reviewed outcomes from joint bio and chemistry research, discussed future agendas including physical AI semiconductors and climate-response crops, and explored broader cooperation on brain disease research. The next meeting will be held in Seoul.

Industry

Applied Materials, Broadcom to co-develop AI chip packaging

Applied Materials has selected Broadcom as an EPIC innovation partner and will jointly develop next-generation AI chip packaging technology, the companies said on May 21. They said they will use Applied\'s global network of innovation centers to strengthen advanced packaging technology for connecting multiple chips within computing systems. EPIC is Applied\'s ecosystem collaboration platform supporting the full process from semiconductor technology development to commercialisation.