Search results for Heterogeneous Integration
AI & Enterprise
Quandela to pursue joint development of photonic quantum hardware with Korean partners
French photonic quantum computing company Quandela said it will focus over the next two years on finding strategic partners in South Korea and pursuing joint development. It plans cooperation in photonic quantum hardware manufacturing, cryogenic control and system integration, and quantum system operations based on AI, GPUs and high-performance computing. Quandela also unveiled a mid- to long-term roadmap for fault-tolerant quantum computing and proposed a quantum manufacturing consortium involving Korean companies and research institutes.
Industry
SK Hynix highlights \'full stack AI memory\' strategy, focuses on 3D stacking
SK Hynix on Tuesday presented a \'Full-Stack AI Memory\' strategy at its 2026 SK Hynix Future Forum held at the Supex Center on its Icheon campus. The company aims to move beyond supplying memory devices to understanding and co-designing AI systems. Executives outlined bundling different memories such as 3D-stacked DRAM, HBM and HBF to match workload characteristics, alongside system-level co-design with ecosystem partners including AI services, software and accelerators.
Industry
SK hynix unveils CPO technology to break memory bandwidth barrier
SK hynix presented a technology aimed at easing a new bottleneck in AI infrastructure in a paper published in the journal Nature Electronics. The company said ultra-large clusters linking thousands of GPUs and HBM are creating a bandwidth barrier that limits data movement between systems. The paper outlines a roadmap for co-packaged optics, with targets including more than 100 Tb/s per node and less than 1 pJ/bit energy use.
-
AI & Enterprise
South Korea, Italy discuss science and technology cooperation in AI, climate and bio
-
Industry
Applied Materials, Broadcom to co-develop AI chip packaging
-
Opinion
Why the semiconductor industry\'s next growth requires more investment in collaboration
-
Industry
Applied Materials, SK Hynix to jointly develop next-generation DRAM, HBM
-
AI & Enterprise
Unnnet starts expanding TarantulaDB, AI data platform separating operations and analytics
-
Industry
AMAT to present energy-efficient AI chip technology at Semicon Korea 2026
-
Industry
KAIST develops AI chip integrating sensing, computing and memory