Search results for Heterogeneous Integration
Industry
Applied Materials, Broadcom to co-develop AI chip packaging
Applied Materials has selected Broadcom as an EPIC innovation partner and will jointly develop next-generation AI chip packaging technology, the companies said on May 21. They said they will use Applied\'s global network of innovation centers to strengthen advanced packaging technology for connecting multiple chips within computing systems. EPIC is Applied\'s ecosystem collaboration platform supporting the full process from semiconductor technology development to commercialisation.
Opinion
Why the semiconductor industry\'s next growth requires more investment in collaboration
The semiconductor industry is evolving rapidly, expanding opportunities for value-creating innovation in areas such as AI optimisation in fabs, advanced packaging and sustainability. As technology development and commercialisation become more complex, collaboration among stakeholders is becoming increasingly important and a key factor in competitiveness. Lam Research is accelerating ecosystem-building through Lam Capital, its corporate venture arm. Its venture competition connects promising semiconductor and deeptech startups with companies, investors and experts, offering finalists networking and a $250,000 investment offer for the winner.
Industry
Applied Materials, SK Hynix to jointly develop next-generation DRAM, HBM
Applied Materials and SK Hynix signed a long-term R&D partnership to develop next-generation DRAM and high bandwidth memory for AI and high-performance computing, the companies said on Tuesday. They plan to build and run the Applied EPIC center in Silicon Valley this year, with SK Hynix joining as a founding partner. The effort will focus on new materials, process integration and advanced packaging, with the center expected to expand to $5 billion.
