Search results for Heterogeneous Integration
AI & Enterprise
South Korea, Italy discuss science and technology cooperation in AI, climate and bio
South Korea and Italy will expand science and technology cooperation centred on three areas: artificial intelligence, climate change and bio, South Korea\'s Ministry of Science and ICT said. The two countries held the 13th Korea-Italy Joint Committee on Science and Technology in Rome with Italy\'s Ministry of Foreign Affairs and International Cooperation. They reviewed outcomes from joint bio and chemistry research, discussed future agendas including physical AI semiconductors and climate-response crops, and explored broader cooperation on brain disease research. The next meeting will be held in Seoul.
Industry
Applied Materials, Broadcom to co-develop AI chip packaging
Applied Materials has selected Broadcom as an EPIC innovation partner and will jointly develop next-generation AI chip packaging technology, the companies said on May 21. They said they will use Applied\'s global network of innovation centers to strengthen advanced packaging technology for connecting multiple chips within computing systems. EPIC is Applied\'s ecosystem collaboration platform supporting the full process from semiconductor technology development to commercialisation.
Opinion
Why the semiconductor industry\'s next growth requires more investment in collaboration
The semiconductor industry is evolving rapidly, expanding opportunities for value-creating innovation in areas such as AI optimisation in fabs, advanced packaging and sustainability. As technology development and commercialisation become more complex, collaboration among stakeholders is becoming increasingly important and a key factor in competitiveness. Lam Research is accelerating ecosystem-building through Lam Capital, its corporate venture arm. Its venture competition connects promising semiconductor and deeptech startups with companies, investors and experts, offering finalists networking and a $250,000 investment offer for the winner.
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Industry
Applied Materials, SK Hynix to jointly develop next-generation DRAM, HBM
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AI & Enterprise
Unnnet starts expanding TarantulaDB, AI data platform separating operations and analytics
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Industry
AMAT to present energy-efficient AI chip technology at Semicon Korea 2026
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Industry
KAIST develops AI chip integrating sensing, computing and memory