Applied Materials (AMAT) Korea said on Jan. 29 it will participate in Semicon Korea 2026, which will be held at COEX in Seoul from Feb. 11 to 13.

Applied Materials will present energy-efficient computing technology through a technology symposium, forums and seminars. It will showcase innovative materials engineering technologies driven by the accelerated adoption of AI and introduce advanced packaging solutions.

At the SEMI technology symposium, it will introduce key technologies for advanced semiconductor manufacturing processes. Yichao Huang (이차오 황), director of the epitaxy business unit, will present next-generation epitaxy solutions to enable high-performance and high-efficiency chips. The topic is "Epitaxial Precision Engineering for Advanced Node Scaling."

Sangjun Choi (최상준), senior director for global product marketing and management, will deliver a lecture on next-generation plasma etching technology as AI workloads expand. Brian Brown (브라이언 브라운), vice president of technology, will introduce CMP technology for heterogeneous integration. Michael Chudzick (마이클 추지크), vice president of technology at the Semiconductor Products Group, will present on advanced packaging technology.

At the cybersecurity forum, Seokwon Kang (강석원), director of information security, will present ways to expand cybersecurity cooperation within South Korea's semiconductor industry. It will also cover strengthening supply chain security through a standardized semiconductor cybersecurity assessment framework. Selim Nahas (셀림 나하스), director of global strategic marketing, will present an outlook for AI technology at the smart manufacturing forum.

It will also participate in a "Meet the Experts" mentoring seminar. It is aimed at supporting young talent entering the semiconductor field. Junsu Han (한준수), an equipment engineer at Applied Materials Korea, will take part as a speaker.