Samsung Electronics is moving to counter rivals in the next-generation high-bandwidth memory market by bringing base die production in-house. As HBM4 increasingly requires foundry processes on the base die, Samsung is highlighting its ability to combine design, foundry and packaging in a turnkey approach. The company has signed an MOU with AMD for primary HBM4 supply and is discussing broader cooperation with Nvidia, while challenges such as wafer warpage and low yields remain.

Nvidia CEO Jensen Huang attended a \"Korea AI Ecosystem Reception\" on June 8 to wrap up a five-day visit, saying South Korea is unmatched in heavy industry, manufacturing, electronics and AI software and that hundreds of billions of dollars in revenue would flow into the country over the next five years. He urged venture capitalists and the government to support AI startups and highlighted physical AI cooperation. Deputy Prime Minister Bae Kyung-hoon cited plans on next-generation accelerators, GTC Korea and GPU price talks.