Search results for HBM5
Industry
SK Hynix unveils iHBM with built-in cooling for HBM packages
SK Hynix unveiled its iHBM technology on May 26, embedding integrated cooling elements in HBM packages to secure a dedicated heat-release path. The company said the structural change can reduce thermal resistance by more than 30 percent and maintain stable operation in high-temperature, high-load conditions. It applies an advanced MR-MUF-based wafer-level packaging process and is designed for compatibility with existing SiP environments. SK Hynix plans to apply it sequentially from next-generation products such as HBM5.
Industry
Custom HBM era raises uncertainty over supply chain information
Uncertainty is growing around the next-generation high bandwidth memory (HBM) market as HBM4 moves toward customer-optimised custom products, reducing information transparency. With key specifications and timelines shared mainly between customers and manufacturers, supply chain visibility has narrowed. Industry sources say HBM4 also requires three-way cooperation among fabless designers, foundries and memory makers. SK Hynix says HBM4 is proceeding as scheduled and inventories will fall further in the second half of 2026.
Industry
Hanmi Semiconductor posts 251.4 billion won 2025 operating profit, down 1.6 percent
Hanmi Semiconductor said on Feb. 9 it posted 576.7 billion won in 2025 revenue and 251.4 billion won in operating profit. Revenue rose 3.2 percent from a year earlier, while operating profit fell 1.6 percent. Fourth-quarter revenue came to 83.0 billion won and operating profit to 27.6 billion won, down 50.1 percent and 59.2 percent from the previous quarter. The company cited sales of equipment used to make HBM for AI chips.