Search results for FinFET
Industry
Samsung Electronics\' turnkey strategy aims to reverse market share in HBM4
Samsung Electronics is moving to counter rivals in the next-generation high-bandwidth memory market by bringing base die production in-house. As HBM4 increasingly requires foundry processes on the base die, Samsung is highlighting its ability to combine design, foundry and packaging in a turnkey approach. The company has signed an MOU with AMD for primary HBM4 supply and is discussing broader cooperation with Nvidia, while challenges such as wafer warpage and low yields remain.
Industry
TSMC unveils roadmap through 2029 featuring A13, A12 and N2U processes
TSMC, the world’s largest foundry, unveiled its semiconductor process roadmap through 2029, introducing next-generation A13, A12 and N2U processes. It adjusted parts of its existing plan, pushing A16 mass production to 2027 to match key customer product schedules. The company said A13 targets a 6 percent chip area reduction while keeping design rules, and N2U aims performance and power gains. TSMC also highlighted packaging technologies including CoWoS and SoW-X.
Industry
Memory big two poised for Q1 earnings surprise, step up business overhaul
Samsung Electronics and SK Hynix are expected to post first-quarter results above market expectations, as rising DRAM and NAND prices lift profits. Brokerages estimate Samsung’s operating profit at 41.3 trillion to 45.3 trillion won, and SK Hynix’s at 36.9 trillion to 39.4 trillion won. Samsung is linking foundry and HBM4 advances, while SK Hynix is preparing a U.S. ADR listing and discussing long-term supply contracts.
