Search results for CoWoS
Industry
TSMC unveils roadmap through 2029 featuring A13, A12 and N2U processes
TSMC, the world’s largest foundry, unveiled its semiconductor process roadmap through 2029, introducing next-generation A13, A12 and N2U processes. It adjusted parts of its existing plan, pushing A16 mass production to 2027 to match key customer product schedules. The company said A13 targets a 6 percent chip area reduction while keeping design rules, and N2U aims performance and power gains. TSMC also highlighted packaging technologies including CoWoS and SoW-X.
Industry
TSMC dominance shows cracks, boosting Samsung foundry opportunity
The foundry market is entering a new phase as TSMC’s grip shows signs of weakening amid advanced packaging bottlenecks, opening room for rivals. Counterpoint Research said global foundry revenue rose 16 percent last year to $320 billion on steady AI chip demand. It expects TSMC’s share to slip this year, with Samsung and SMIC moving in. Samsung is pushing 2-nanometre production, while SMIC expands capacity and Intel seeks large AI customers.
Industry
Nvidia seen reverting Rubin CPX memory to HBM from GDDR7
Market expectations are growing that Nvidia could switch the memory in its next-generation AI inference accelerator, Rubin CPX, from GDDR7 back to high-bandwidth memory. The view is driven by assessments that large-scale production inference workloads require more bandwidth and capacity than GDDR7 can efficiently provide. Rising inference demand cited by CEO Jensen Huang and comments on supply constraints have added momentum. A switch would require redesign and could affect HBM supply-demand outlooks.
