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China\'s top 3 semiconductor packaging firms see profit surge in H1, launch 15 billion yuan expansion race

China’s three largest semiconductor packaging and testing (OSAT) companies have launched an expansion race as demand for AI semiconductors surges and profits grow at triple-digit rates. Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Huatian Technology together announced more than 15 billion yuan ($2.2 billion) in first-half capacity expansion plans, focused on advanced packaging for AI accelerators. Other firms and Taiwan’s ASE also increased investment plans.

Industry

Apple\'s $1 billion chip output stuck at TSMC as DRAM shortage delays final packaging

Apple’s next-generation mobile chip, believed to be the A20 Pro, is reportedly unable to enter final packaging at TSMC because of a shortage of DRAM. About $1 billion worth of completed Apple silicon wafers is waiting to move to the next process. Production volume and yields are said to be solid, but required LPDDR5X memory has not arrived. With a new packaging structure integrating processor and DRAM at the wafer stage, Apple cannot stockpile chips without memory.

Industry

Azicland posts 2.9 billion won Q1 operating loss, improves 7.0 billion won from previous quarter

Azicland said on Thursday it posted first-quarter consolidated revenue of 54.0 billion won and an operating loss of 2.9 billion won. Revenue jumped 242 percent from a year earlier to the highest quarterly level since its founding. The operating loss narrowed by nearly 7.0 billion won from the previous quarter, and the operating margin improved by about 45 percentage points from a year earlier, bringing it closer to break-even.