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Industry
Applied Materials, BE Semiconductor Industries expand EPIC Center cooperation for AI packaging
Applied Materials said on Thursday it will expand its strategic partnership with BE Semiconductor Industries, with BESI joining Applied\'s EPIC Center as an innovation partner. The companies plan to widen cooperation beyond their joint development program launched in 2020 to cover new interconnect structures and applications. They will jointly optimise process and assembly solutions across advanced packaging, from wafer-level hybrid bonding to panel-scale integration, aiming to deliver jointly optimised results to customers earlier.
Industry
China starts domestic production of DUV lithography tools; ASML and chip equipment stocks slide
A Chinese state-owned company has been reported to begin producing immersion deep ultraviolet (DUV) lithography equipment, a key tool for semiconductor manufacturing, raising tension in the global chip equipment market. The company is said to plan supplies to Chinese chipmakers including SMIC and CXMT. Commercial deployment is expected to take time, with limited output targets. ASML shares fell about 7 percent and other related stocks also declined.
Industry
HBM beyond 16 layers brings memory makers\' hybrid bonding shift into view
As high-bandwidth memory stacks move beyond 16 layers, a shift in bonding technology is coming into view, with the three memory makers reviewing a phased introduction of hybrid bonding from HBM4 or later generations. The move reflects limits in conventional thermal compression bonding, though cost burdens are expected to keep MR-MUF processes in parallel for now. Equipment suppliers are adjusting as supply dynamics may change depending on future mass-production partner choices.
