Search results for Besi
Industry
Dutch chip equipment maker Besi sees surge in hybrid bonding orders on AI infrastructure investment
Dutch semiconductor equipment maker BE Semiconductor Industries (Besi) posted strong quarterly results, benefiting from expanding investment in AI infrastructure. Besi recorded first-quarter revenue of 185 million euros and net profit of 52 million euros, according to a recent report by Techzine. Its order backlog rose and beat analysts\' forecasts, more than doubling on an annual basis. CEO Richard Blickman highlighted particularly strong demand for hybrid bonding systems.
Industry
Lam Research, Applied Materials consider acquiring Dutch chip equipment maker BESI
Dutch chip equipment maker BE Semiconductor Industries (BESI) has emerged as a potential acquisition target for major U.S. chip equipment companies. Lam Research and Applied Materials are reported to be considering a takeover. Reuters reported talks began in mid-2025, were paused early this year amid geopolitical tensions between the United States and the European Union over Greenland, and have recently resumed. BESI has selected Morgan Stanley as adviser and says it will remain independent.
Industry
Korean HBM equipment makers target Japan\'s semiconductor market
Japan\'s Rapidus is expected to place equipment orders ahead of the April start-up of its back-end R&D centre in Hokkaido. The centre will focus on chiplet-based advanced packaging such as FC-BGA, silicon interposers and hybrid bonding. The article says Japan is strong in front-end tools but lacks a robust back-end equipment ecosystem for HBM and 2.5D packaging, creating opportunities for Korean suppliers. It cites recent supply deals by Hanmi Semiconductor and Hanwha Semitec with SK Hynix.