Search results for Besi
Industry
China starts domestic production of DUV lithography tools; ASML and chip equipment stocks slide
A Chinese state-owned company has been reported to begin producing immersion deep ultraviolet (DUV) lithography equipment, a key tool for semiconductor manufacturing, raising tension in the global chip equipment market. The company is said to plan supplies to Chinese chipmakers including SMIC and CXMT. Commercial deployment is expected to take time, with limited output targets. ASML shares fell about 7 percent and other related stocks also declined.
Industry
HBM beyond 16 layers brings memory makers\' hybrid bonding shift into view
As high-bandwidth memory stacks move beyond 16 layers, a shift in bonding technology is coming into view, with the three memory makers reviewing a phased introduction of hybrid bonding from HBM4 or later generations. The move reflects limits in conventional thermal compression bonding, though cost burdens are expected to keep MR-MUF processes in parallel for now. Equipment suppliers are adjusting as supply dynamics may change depending on future mass-production partner choices.
Industry
Dutch chip equipment maker Besi sees surge in hybrid bonding orders on AI infrastructure investment
Dutch semiconductor equipment maker BE Semiconductor Industries (Besi) posted strong quarterly results, benefiting from expanding investment in AI infrastructure. Besi recorded first-quarter revenue of 185 million euros and net profit of 52 million euros, according to a recent report by Techzine. Its order backlog rose and beat analysts\' forecasts, more than doubling on an annual basis. CEO Richard Blickman highlighted particularly strong demand for hybrid bonding systems.
