Search results for Besi
Industry
HBM beyond 16 layers brings memory makers\' hybrid bonding shift into view
As high-bandwidth memory stacks move beyond 16 layers, a shift in bonding technology is coming into view, with the three memory makers reviewing a phased introduction of hybrid bonding from HBM4 or later generations. The move reflects limits in conventional thermal compression bonding, though cost burdens are expected to keep MR-MUF processes in parallel for now. Equipment suppliers are adjusting as supply dynamics may change depending on future mass-production partner choices.
Industry
Dutch chip equipment maker Besi sees surge in hybrid bonding orders on AI infrastructure investment
Dutch semiconductor equipment maker BE Semiconductor Industries (Besi) posted strong quarterly results, benefiting from expanding investment in AI infrastructure. Besi recorded first-quarter revenue of 185 million euros and net profit of 52 million euros, according to a recent report by Techzine. Its order backlog rose and beat analysts\' forecasts, more than doubling on an annual basis. CEO Richard Blickman highlighted particularly strong demand for hybrid bonding systems.
Industry
Lam Research, Applied Materials consider acquiring Dutch chip equipment maker BESI
Dutch chip equipment maker BE Semiconductor Industries (BESI) has emerged as a potential acquisition target for major U.S. chip equipment companies. Lam Research and Applied Materials are reported to be considering a takeover. Reuters reported talks began in mid-2025, were paused early this year amid geopolitical tensions between the United States and the European Union over Greenland, and have recently resumed. BESI has selected Morgan Stanley as adviser and says it will remain independent.
