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Samsung Electronics to supply 2nm foundry and HBM to Broadcom

Samsung Electronics has begun large-scale cooperation with Broadcom in the AI semiconductor infrastructure market. Samsung said it signed a strategic memorandum of understanding with Broadcom at an AI Summit in San Francisco on July 24 local time to build next-generation AI infrastructure. The companies plan cooperation worth more than $200 billion through 2030 across memory, foundry and advanced packaging. Samsung will supply HBM, including HBM4 and HBM4E, and apply processes of 2 nm or below for key Broadcom chips.