Texas Instruments (TI) unveiled next-generation insulated power modules targeting the data centre and electric vehicle markets. Using its in-house IsoShield multi-chip packaging technology, it increased power density by up to three times compared with existing solutions and reduced solution size by up to 70 percent.

TI held a media briefing on March 24 and introduced the insulated bias power supplies UCC34141 and UCC14240, which apply the IsoShield technology. The briefing identified data centres, where AI cloud demand is rapidly increasing rack-level power requirements, and EVs, which require higher output in limited vehicle space, as key target markets.

Park Soo-min (박수민), analog technical support at TI Korea, said, "The challenge of having to integrate more power into a smaller space is appearing in the same way for both EVs and data centres." She said advantages must be secured at the same time in terms of efficiency, heat, EMI (electromagnetic interference), reliability and space.

TI highlighted two technologies at the briefing: IsoShield and MagPack. MagPack is a magnetic packaging solution that integrates an inductor inside an IC package to cut the power module footprint by up to 50 percent. By reducing loop area it also improves EMI performance, and TI said it provides consistent performance compared with discrete components.

IsoShield integrates a high-performance planar coil transformer and an insulated power stage into a single multi-chip package. In existing solutions, a controller IC, external inductor, transformer and dozens of passive components are distributed across a PCB, but applying IsoShield integrates them into one package to reduce component count and design risk.

Park said the transformer height in existing solutions reached 11 mm, but the new product applying IsoShield technology lowers it to 2.65 mm. She said the key is cutting package height to one-fifth while maintaining insulation performance at the level of several kilovolts. She added that it is 43 percent smaller than competing modules and has 50 percent fewer components.

◆ Major OEMs and tier-1 suppliers reviewing adoption…aim to pre-empt next-generation power standards

In EVs, it will be applied first to onboard chargers and DC-DC converters. It is used as a gate-driver bias power supply, where insulation between high-power ground and low-power ground is essential, and can be combined with TI's gate driver UCC2651 to build a single-vendor solution from the power stage to gate output. Automotive-grade products can operate between minus 45 degrees Celsius and 125 degrees Celsius.

On advantages in reducing companies' total cost of ownership, Park said shrinking the SiC module area and miniaturising packaging technology share a "common goal". She said in the task of reducing total PCB area, miniaturising SiC modules and miniaturising analog power solutions move in the same direction.

On the burden on supply-chain partners, she said, "Because it is at the level of a layout change, there is no risk that board makers need to respond to separately." On market adoption speed, she added, "UCC34141 is a product that simultaneously solves footprint reduction and heat issues, and it is currently being reviewed positively by major tier-1 companies and OEMs."

In data centres, TI collaborated with Nvidia to unveil an 800V DC reference design for next-generation AI data centres at APEC 2025. Park said as global data centre infrastructure continues to expand, the need for high power-density solutions in rack and server power supplies is growing. She said the goal is to achieve performance and power density at the same time while maintaining reliability and safety.