Search results for TC bonder
Industry
Hanwha Semitec showcases advanced packaging lineup at Semicon Taiwan
Hanwha Semitec will take part in Semicon Taiwan 2026 at the Nangang Exhibition Center in Taipei and introduce four advanced packaging tools, the company said on Tuesday. It will exhibit the SFM5 Square fan-out panel-level packaging tool, the SFM5 Expert 3D TC bonder, the SFM5 TnR 2.5D CoW bonder and the SHB2 Nano hybrid bonder. The SFM5 Square will be shown as a physical unit for the first time.
Industry
HBM beyond 16 layers brings memory makers\' hybrid bonding shift into view
As high-bandwidth memory stacks move beyond 16 layers, a shift in bonding technology is coming into view, with the three memory makers reviewing a phased introduction of hybrid bonding from HBM4 or later generations. The move reflects limits in conventional thermal compression bonding, though cost burdens are expected to keep MR-MUF processes in parallel for now. Equipment suppliers are adjusting as supply dynamics may change depending on future mass-production partner choices.
Industry
Hanwha Semitec completes development of second-generation hybrid bonder
Hanwha Semitec has developed a second-generation hybrid bonder and plans to deliver the SHB2 Nano to customers in the first half of this year for performance testing, the company said on Tuesday. The equipment directly bonds chips on copper surfaces and is seen as a next-generation technology for boosting performance and productivity of high-bandwidth memory for AI semiconductors. Hanwha Semitec also aims to strengthen its position in the TC bonder market and is developing a second-generation TC bonder.
