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Industry

Hanwha Semitec completes development of second-generation hybrid bonder

Hanwha Semitec has developed a second-generation hybrid bonder and plans to deliver the SHB2 Nano to customers in the first half of this year for performance testing, the company said on Tuesday. The equipment directly bonds chips on copper surfaces and is seen as a next-generation technology for boosting performance and productivity of high-bandwidth memory for AI semiconductors. Hanwha Semitec also aims to strengthen its position in the TC bonder market and is developing a second-generation TC bonder.

Industry

Hanmi Semiconductor posts 251.4 billion won 2025 operating profit, down 1.6 percent

Hanmi Semiconductor said on Feb. 9 it posted 576.7 billion won in 2025 revenue and 251.4 billion won in operating profit. Revenue rose 3.2 percent from a year earlier, while operating profit fell 1.6 percent. Fourth-quarter revenue came to 83.0 billion won and operating profit to 27.6 billion won, down 50.1 percent and 59.2 percent from the previous quarter. The company cited sales of equipment used to make HBM for AI chips.