Search results for Peking University
Industry
China\'s EDA industry joins Huawei\'s Tau Scaling 3D chip push; commercialisation seen 4 to 5 years away
China\'s semiconductor design software industry is moving to support Huawei\'s next-generation chip strategy, with companies developing tools aligned to its Tau Scaling framework and 3D design approach. Empyrean Technology unveiled a 3D IC verification platform, while a Peking University team showed a prototype compatible with Huawei\'s Logic Folding architecture. Industry and research groups say technical hurdles and gaps with U.S.-led full-flow EDA suites mean commercialisation could take 4 to 5 years.
AI & Enterprise
Enhance has 3 papers accepted at ICML, ACL and ICPR
Agentic AI startup Enhance said on Wednesday that it had three papers accepted at three international AI conferences. All three were led by Enhance AI researcher Won-deok Seo as first author, it said. Enhance plans to use the results to advance its core AgentOS service technology. The accepted papers cover a framework to address cultural bias in large language models, a multi-agent framework for automated data science, and a framework for visualization code synthesis.
Industry
SemiFive pushes to commercialise eMRAM-based edge AI chip
SemiFive and ICY Tech said on May 7 they succeeded in taping out an edge AI semiconductor based on Samsung Foundry\'s 8-nanometre eMRAM technology. They said it is the first case in Asia in which 8-nanometre eMRAM technology is introduced into a commercial product. The project combined ICY Tech\'s processing-near-memory technology with SemiFive\'s SoC design platform to enable AI computing in edge environments without a separate network connection.
