Search results for PECVD
Industry
Applied Materials unveils two deposition systems for sub-2 nm GAA processes
Applied Materials on Monday unveiled two deposition systems tailored for sub-2 nanometre gate-all-around (GAA) transistor processes. The company said GAA transistor fabrication requires more than 500 process steps to build internal 3D structures, with many steps demanding near-atomic tolerances. One system uses selective bottom-up silicon nitride deposition to protect shallow trench isolation structures and reduce parasitic capacitance. The other controls metal gate stacks with atomic-level uniformity and integrates multiple metal deposition steps on one platform.
Industry
Yield takes center stage at Semicon Korea 2026
Yield emerged as the key theme at Semicon Korea 2026, held at Seoul\'s COEX from Feb. 11, as the event drew 550 companies and 75,000 pre-registered visitors. With HBM4 and 2-nanometre processes approaching mass production, interest has surged in metrology and inspection equipment to detect hidden defects. SK Hynix executives flagged a technology inflection point and urged AI-based R&D. Equipment makers showcased next-generation inspection and bonding technologies.
Industry
IST E wins additional orders for HBM-specific FOUP cleaner equipment
IST E said on Sunday it has won an additional supply contract from SK Hynix for FOUP cleaner equipment dedicated to HBM and will deliver the equipment by July 21. The company previously won an order for the same equipment in January. FOUP cleaners remove contaminants inside FOUPs used to transport and store wafers, helping improve process stability. IST E said it is upgrading its semiconductor equipment lineup and plans to expand equipment supply.
