Search results for High NA EUV
Industry
Samsung Electronics to adopt ASML high-NA EUV for DRAM in 2028
Samsung Electronics said on Tuesday it has joined ASML\'s large mask consortium to co-develop next-generation 12-inch photomasks and plans to introduce high-NA EUV tools into advanced DRAM manufacturing by 2028. The shift from 6-inch to 12-inch masks alongside high-NA EUV is aimed at easing stitching constraints, boosting fab productivity and lowering chip manufacturing costs. Samsung and ASML also plan to strengthen cooperation and seek further collaboration opportunities.
Industry
Intel buys ASML high-NA EUV lithography tool barred from China
Dutch chip equipment maker ASML has started shipping its next-generation high-NA EUV lithography tools to chip plants, with each unit costing $400 million. The system can achieve 8-nanometer resolution and draw finer circuits than existing EUV tools. Intel is the leading early customer after bringing in its first tool in 2024 for assembly and testing. Cost and U.S.-driven export curbs on sales to China are shaping adoption.
Industry
IBM, Lam Research expand cooperation to develop sub-1-nanometer semiconductor processes
IBM and Lam Research have signed a five-year cooperation agreement to develop semiconductors below 1 nanometer. The collaboration focuses on new materials, manufacturing process innovation and securing High-NA EUV lithography technology to accelerate IBM’s logic scaling roadmap. The companies will use IBM research facilities and Lam process equipment at the Albany Nanotech Complex in New York. They did not disclose manufacturing partners or a commercial production schedule.