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Industry

AMAT says AI chip performance hinges on data movement, solution is 3D scaling

Applied Materials says efficiency in moving data, rather than computing speed, is the main bottleneck for AI semiconductor performance and that the industry solution is 3D scaling. It described 3D scaling across logic, memory and packaging, and said capacity expansion should accompany demand. The company detailed approaches for DRAM, a shift in HBM stacking from micro-bumps to hybrid bonding, and panel interposer development, while highlighting cooperation with Samsung Electronics and SK Hynix in Korea.

Crypto

Bitcoin miner profitability indicator plunges, resembling past bottom zone

A composite indicator tracking stress on bitcoin miners’ revenue fell to a new low in 2026 and entered an undervalued zone. Onchain analyst Gaa Im said the measure has dropped to levels that in the past coincided with cyclical turning points in bitcoin’s price. He cited 2015, 2018, 2020, 2022 and 2024 as similar episodes. The indicator’s deterioration also aligns with bitcoin’s decline since its October 2025 all-time high.

Industry

Intel pushes into foundry market, focus on Samsung response

Intel’s push into the contract chipmaking market is becoming visible through orders from big tech firms, with Tesla set to use Intel’s 14A process for AI chips and Google reportedly shifting part of TPU production. The move comes as TSMC capacity constraints have opened space for alternatives such as Samsung Electronics. Intel’s U.S. government backing and leadership hires add to competition for U.S. customer volumes, as Samsung prepares to outline its technology strategy at upcoming forums in Seoul.