Intel’s push into the contract chipmaking market is becoming visible through orders from big tech firms, with Tesla set to use Intel’s 14A process for AI chips and Google reportedly shifting part of TPU production. The move comes as TSMC capacity constraints have opened space for alternatives such as Samsung Electronics. Intel’s U.S. government backing and leadership hires add to competition for U.S. customer volumes, as Samsung prepares to outline its technology strategy at upcoming forums in Seoul.

Applied Materials has introduced two new semiconductor process systems aimed at addressing uniformity challenges in high-stack 3D chip structures as demand for AI chips grows. The company unveiled the Centris Spectral SiN atomic layer deposition system and the Producer Selectra molybdenum etch system. It said the tools support transitions to vertical chip architectures such as GAA transistors and high-stack 3D NAND by improving deposition and etch uniformity in deep, narrow structures.