Search results for FCBGA
Industry
Samsung Electro-Mechanics, LG Innotek face off over next-generation substrates at KPCA
Samsung Electro-Mechanics and LG Innotek are unveiling new semiconductor package substrate technologies at KPCA Show 2026 in Incheon from Sept. 9 to 11. Samsung Electro-Mechanics is exhibiting five items including 2.5D and 2.1D package substrates, glass substrates and automotive FCBGA. LG Innotek is debuting an AI accelerator FC-BGA and plans mass production of high value-added FC-BGA for AI training and inference in 2027. Both are accelerating glass substrate development.
Industry
Samsung Electro-Mechanics posts 440.4 billion won Q2 operating profit, up 107 percent
Samsung Electro-Mechanics said its second-quarter operating profit more than doubled from a year earlier, helped by demand for AI and automotive applications. Revenue rose 24 percent to 3.46 trillion won and operating profit climbed 107 percent to 440.4 billion won. Pretax profit increased 153 percent and net profit rose 143 percent. Component and package sales gained, while optics rose from a year earlier but fell from the prior quarter.
Industry
AI chip glass substrate supply chain race enters round two, expands into materials alliances
Competition over glass substrates, a next-generation semiconductor packaging material, is shifting from individual company technology validation to a race to build supply chains led by materials alliances. Samsung Electro-Mechanics has moved to set up a 480 billion won joint venture with a Sumitomo Chemical group affiliate. The move sharpens its rivalry with SKC, whose unit Absolics has completed construction of a glass substrate mass-production line in Georgia.
