AI & Enterprise
KAIST cuts AI chip cooling energy by 90 percent
Researchers at the Korea Advanced Institute of Science and Technology (KAIST) have developed a technology that cuts the cooling energy needed to remove heat from artificial intelligence semiconductors to one-tenth of current levels. The method combines a coolant manifold and microchannels inside a chip to improve liquid cooling efficiency and reduce energy loss. KAIST said the design delivered a coefficient of performance of 106,000 using room-temperature water and can be applied without major new production-line investment.
