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[Snapdragon Summit 2026] \"A chip like a racing engine... Move memory to the side to secure a heat-dissipation path\"

Qualcomm applied a new package design to the Snapdragon 8 Elite Extreme Gen 6 by moving memory to the side and creating a new path to dissipate heat, aiming to sustain high burst performance longer in top-end smartphones. Chris Patrick (크리스 패트릭) said keeping the SoC cool helps it stay at maximum performance longer. Qualcomm said handset makers may need minor cooling design changes and it is reviewing other packaging approaches.

Industry

Qualcomm maps AI future: smartphones stay, agents need partners, personalisation starts on the body

Qualcomm is setting agentic AI as the direction for its Snapdragon portfolio, unveiling two flagship mobile platforms and new PC, audio and wearable platforms at Snapdragon Summit 2026 in Maui. The company said smartphones will remain the central device, agents will require partner software that handles memory, judgement and action on-chip, and personalisation will begin with body-worn devices such as watches, earbuds and glasses that gather context.

Industry

Snapdragon Summit 2026: Will Qualcomm\'s multi-flagship strategy widening OEM options work?

Qualcomm is splitting its flagship mobile platform into two products with different dies and packages, aiming to let smartphone makers choose features by model and lower average costs across lineups. Features such as 8K 60fps capture and the APV codec are limited to the Snapdragon 8 Elite Extreme 6th Gen. Executives said the two platforms share CPU design but differ in GPU features, memory and accelerators, and show AI performance gaps in parallel tasks.