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Industry

AMAT says AI chip performance hinges on data movement, solution is 3D scaling

Applied Materials says efficiency in moving data, rather than computing speed, is the main bottleneck for AI semiconductor performance and that the industry solution is 3D scaling. It described 3D scaling across logic, memory and packaging, and said capacity expansion should accompany demand. The company detailed approaches for DRAM, a shift in HBM stacking from micro-bumps to hybrid bonding, and panel interposer development, while highlighting cooperation with Samsung Electronics and SK Hynix in Korea.

Industry

Absolics decides 401.1 billion won rights issue to commercialise glass substrates

Competition to commercialise semiconductor substrates made of glass has entered a fundraising phase. SKC said its glass-substrate venture Absolics decided on a 401.1 billion won shareholder-allocated rights issue. Absolics plans to use the funds for glass-substrate evaluation and customer certification, and to improve yields and quality through equipment upgrades. Development is proceeding on embedding and non-embedding products. Additional investment will be executed in line with customer evaluations and milestone targets.

AI & Enterprise

Big Short\'s Michael Burry resumes Tesla short, targets Nvidia and semiconductor ETF

Investor Michael Burry, known as the real-life figure behind the film \'The Big Short\', disclosed a new short position in Tesla at $416.22 as part of a broader wager against what he called overheating in AI and semiconductors. He also listed shorts in Caterpillar, Nvidia, iShares Semiconductor ETF and Applied Materials. He did not disclose the size or structure of the Tesla position. Burry argued semiconductor valuations are at an extreme level.