Search results for 3D NAND
Industry
China tungsten curbs disrupt WF6 supplies, raising risks for HBM and AI chip output
The push to expand AI semiconductor output is straining supply chains for specialty electronic gases, an analysis said. China’s controls on high-purity tungsten exports have led to disruptions in Japan’s supply of tungsten hexafluoride (WF6), raising new supply-chain risks for high-bandwidth memory, DRAM and advanced logic chips. Usage of specialty gases rises sharply as processes shrink and as HBM and 3D NAND output expands. Alternative suppliers are limited, while Chinese producers are expanding capacity and prices have risen.
Industry
Applied Materials launches new tools to improve AI chip performance
Applied Materials has introduced two new semiconductor process systems aimed at addressing uniformity challenges in high-stack 3D chip structures as demand for AI chips grows. The company unveiled the Centris Spectral SiN atomic layer deposition system and the Producer Selectra molybdenum etch system. It said the tools support transitions to vertical chip architectures such as GAA transistors and high-stack 3D NAND by improving deposition and etch uniformity in deep, narrow structures.
Industry
AI-driven NAND flash supply shortage hits memory card market
Sony has temporarily suspended orders for CFexpress and SD memory cards as shortages of NAND flash memory worsen due to demand from expanding AI data centres, Techzin reported on March 30. The company cannot procure parts and has not set a date to resume orders. The affected products include CFexpress Type A, CFexpress Type B and SDXC and SDHC cards, which use TLC 3D NAND also used in enterprise SSDs.
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Industry
HBM battle lines and DRAM price direction: March semiconductor events in focus
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Industry
Chip equipment makers step up test chip competition as proof demands rise
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Industry
Chipmetrics targets South Korea as 3D NAND heads toward 1,000 layers
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Industry
European semiconductor technology firms turn to South Korea