| Mobile Web

Search results for 3D NAND

Industry

Water infrastructure demand rises with fab expansions in Yongin and southwest; ultrapure and reuse systems gain ground

Water infrastructure demand is expected to grow alongside semiconductor fab expansions in South Korea, with the ability to secure water emerging as a key pre-investment check for capex. Water use by major chipmakers far exceeds that of other large facilities, and planned expansions in Yongin and the southwest are set to raise demand further. This is driving adoption of ultrapure water, zero-liquid-discharge reuse and integrated treatment designs, while supply schedules and permitting risks remain.

Industry

China tungsten curbs disrupt WF6 supplies, raising risks for HBM and AI chip output

The push to expand AI semiconductor output is straining supply chains for specialty electronic gases, an analysis said. China’s controls on high-purity tungsten exports have led to disruptions in Japan’s supply of tungsten hexafluoride (WF6), raising new supply-chain risks for high-bandwidth memory, DRAM and advanced logic chips. Usage of specialty gases rises sharply as processes shrink and as HBM and 3D NAND output expands. Alternative suppliers are limited, while Chinese producers are expanding capacity and prices have risen.

Industry

Applied Materials launches new tools to improve AI chip performance

Applied Materials has introduced two new semiconductor process systems aimed at addressing uniformity challenges in high-stack 3D chip structures as demand for AI chips grows. The company unveiled the Centris Spectral SiN atomic layer deposition system and the Producer Selectra molybdenum etch system. It said the tools support transitions to vertical chip architectures such as GAA transistors and high-stack 3D NAND by improving deposition and etch uniformity in deep, narrow structures.