Search results for 3D NAND
Industry
Applied Materials launches new tools to improve AI chip performance
Applied Materials has introduced two new semiconductor process systems aimed at addressing uniformity challenges in high-stack 3D chip structures as demand for AI chips grows. The company unveiled the Centris Spectral SiN atomic layer deposition system and the Producer Selectra molybdenum etch system. It said the tools support transitions to vertical chip architectures such as GAA transistors and high-stack 3D NAND by improving deposition and etch uniformity in deep, narrow structures.
Industry
AI-driven NAND flash supply shortage hits memory card market
Sony has temporarily suspended orders for CFexpress and SD memory cards as shortages of NAND flash memory worsen due to demand from expanding AI data centres, Techzin reported on March 30. The company cannot procure parts and has not set a date to resume orders. The affected products include CFexpress Type A, CFexpress Type B and SDXC and SDHC cards, which use TLC 3D NAND also used in enterprise SSDs.
Industry
HBM battle lines and DRAM price direction: March semiconductor events in focus
March brings a packed global semiconductor calendar, with Nvidia’s GTC expected to outline next-generation AI chips and related high-bandwidth memory demand. China’s annual parliamentary meetings are set to unveil the 2026–2030 five-year plan, potentially detailing subsidies tied to chip self-reliance. Samsung Electronics and SK Hynix shareholder meetings may signal leadership changes and governance shifts. Investors are also watching whether DRAM and NAND contract prices turn at the end of the quarter.
