Search results for 3D IC
Industry
Applied Materials, BE Semiconductor Industries expand EPIC Center cooperation for AI packaging
Applied Materials said on Thursday it will expand its strategic partnership with BE Semiconductor Industries, with BESI joining Applied\'s EPIC Center as an innovation partner. The companies plan to widen cooperation beyond their joint development program launched in 2020 to cover new interconnect structures and applications. They will jointly optimise process and assembly solutions across advanced packaging, from wafer-level hybrid bonding to panel-scale integration, aiming to deliver jointly optimised results to customers earlier.
Industry
China\'s EDA industry joins Huawei\'s Tau Scaling 3D chip push; commercialisation seen 4 to 5 years away
China\'s semiconductor design software industry is moving to support Huawei\'s next-generation chip strategy, with companies developing tools aligned to its Tau Scaling framework and 3D design approach. Empyrean Technology unveiled a 3D IC verification platform, while a Peking University team showed a prototype compatible with Huawei\'s Logic Folding architecture. Industry and research groups say technical hurdles and gaps with U.S.-led full-flow EDA suites mean commercialisation could take 4 to 5 years.
Industry
CoAsia Semi starts supplying 3D IC package SoC products
CoAsia Semi said on Jan. 28 it has started supplying SoC products that apply 3D IC packaging, expanding into next-generation semiconductor packaging. It said this is the first time a South Korean design services company has supplied products using a 3D IC package structure. The product uses a 3D IC package that vertically stacks a custom DRAM using TSV technology with an SoC. Supply begins this month for customer certification and testing, with mass production planned within 2026.