Industry
CoAsia Semi starts supplying 3D IC package SoC products
CoAsia Semi said on Jan. 28 it has started supplying SoC products that apply 3D IC packaging, expanding into next-generation semiconductor packaging. It said this is the first time a South Korean design services company has supplied products using a 3D IC package structure. The product uses a 3D IC package that vertically stacks a custom DRAM using TSV technology with an SoC. Supply begins this month for customer certification and testing, with mass production planned within 2026.
