Zedex, a semiconductor particle-control company, has developed a device to precisely inspect particles on key semiconductor process components. Zedex said on Feb. 19 it launched its M802ESC inspection system for analysing core process components such as electrostatic chucks (ESC), sputtering targets and FOUPs.

M802ESC is the next-generation model of the existing M2000ESC. It was developed to support nano-level ultrafine processes. The company said it can also evaluate components that were difficult to inspect precisely.

The product can inspect components that were difficult to evaluate quantitatively using existing methods because of large, heavy structures and surface precision issues. It processes samples with a diameter of up to 610 mm and is designed for loads of up to 50 kg. It detects particles of 0.1 micrometres or larger as standard, and with an option it can count ultrafine particles using a 10-nanometre sensor.

It uses an X, Y and Z robot-controlled scan-nozzle method to inspect about 90 percent of the surface area evenly. It implements a non-contact particle-extraction system that separates and collects particles without contaminating the sample, applying a patent-based collection head and a structure to prevent particle dispersion. It blocks secondary contamination during inspection. It also maintains a Class 1 ultra-clean environment based on a ULPA filter. The company said this also ensures data reliability.

A Zedex official said, "As data-based evaluation becomes possible even for components that were previously difficult to inspect quantitatively, the paradigm of process yield management will change."