Inox Advanced Materials said on Jan. 26 it will ramp up efforts to target the market for core materials used in advanced industries such as physical AI, robots and AI semiconductors, based on technological capabilities validated in the space and aerospace sector.

The company has been continuously supplying SpaceX with aerospace EMI (electromagnetic shielding) carrier tape since 2023. It is seen as having proven technical reliability in the extreme environment of space.

Inox Advanced Materials has supplied DAF (Die Attach Film), backgrinding tape and EMI carrier tape to global semiconductor companies for years. It said it has recently started pre-mass-production verification to supply a new DAF material to another global top semiconductor company.

The company said the AI semiconductor and HBM (high bandwidth memory) market is focusing on high-density packaging processes that stack chips vertically. It said materials technology that controls warpage and bonding stability issues as wafers become thinner is emerging as a factor in managing semiconductor yields. The DAF it supplies is an adhesive film that connects chips and substrates and provides stability in customers' high-capacity stacking processes.

An Inox Advanced Materials official said, "The technological capabilities proven through supplies to SpaceX will become the foundation for evolving beyond AI semiconductors into core materials for physical AI and robots." The official added, "Through proactive R&D investment, we will widen the technology gap and rapidly expand our new portfolio to secure sustainable growth drivers in the global core materials market."