Industry
Russia challenges chip equipment with technology to cut wafer exposure from two weeks to five minutes
A Russian startup has unveiled multi-cathode electron-beam lithography technology that uses multiple electron beams at once to speed up semiconductor exposure. Developers said a silicon wafer could be exposed in about 5 to 7 minutes, compared with 1 to 2 weeks using a single beam. They said they have verified operation of a multi-cathode electron source, not a complete tool. Experts said industrial use would require further development, stable control and funding.
