Search results for WMCM
Industry
Apple\'s $1 billion chip output stuck at TSMC as DRAM shortage delays final packaging
Apple’s next-generation mobile chip, believed to be the A20 Pro, is reportedly unable to enter final packaging at TSMC because of a shortage of DRAM. About $1 billion worth of completed Apple silicon wafers is waiting to move to the next process. Production volume and yields are said to be solid, but required LPDDR5X memory has not arrived. With a new packaging structure integrating processor and DRAM at the wafer stage, Apple cannot stockpile chips without memory.
Telecommunications & Media
iPhone 18 Pro: six changes, innovation or stagnation?
Apple\'s iPhone 18 Pro lineup is expected to deliver upgrades aimed at improving the overall user experience, including display and design tweaks, a next-generation chip, camera enhancements, battery gains and changes to connectivity hardware. Reports say the front display may shrink the Dynamic Island as Face ID components move under the screen. The phones are also expected to use an A20 Pro chip built on a 2-nanometre process and adopt Apple’s in-house C2 modem.
Telecommunications & Media
Apple likely to name first foldable iPhone \'iPhone Ultra\', rumours say
Apple may launch its first foldable iPhone this autumn and call it the iPhone Ultra, an IT outlet reported. The device is expected to be Apple’s most expensive iPhone and use a book-style inward fold with a wider internal screen. Rumours include a crease-free inner panel, two rear cameras without a telephoto lens, and two front cameras. It may run iOS 27 with enhanced multitasking and use an A20 Pro chip, C2 modem and Touch ID.