Industry
Micron breaks ground on $9.3 billion HBM plant expansion in Hiroshima, Japan
Micron Technology is building a $9.3 billion next-generation memory semiconductor plant in Hiroshima, Japan, to expand production of high-bandwidth memory for AI. It plans to start mass production from summer 2028. Japan’s Ministry of Economy, Trade and Industry will support the project with up to 500 billion yen. The move comes as demand for HBM surges and competition intensifies among SK hynix, Samsung Electronics and Micron.
