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Industry
Semiconductor wafer carrier FOUP emerges as key component in HBM era
Semiconductor wafer carriers known as FOUPs are gaining strategic importance as memory chip manufacturing processes become longer and more intricate, increasing the need for contamination control. Industry sources say advanced chips such as high-bandwidth memory keep wafers in fabs for more than 100 days, raising risks from humidity and airborne molecular contamination. South Korean equipment makers are reporting rising orders for FOUP cleaners and humidity-control solutions used by major memory makers.
Industry
Yield takes center stage at Semicon Korea 2026
Yield emerged as the key theme at Semicon Korea 2026, held at Seoul\'s COEX from Feb. 11, as the event drew 550 companies and 75,000 pre-registered visitors. With HBM4 and 2-nanometre processes approaching mass production, interest has surged in metrology and inspection equipment to detect hidden defects. SK Hynix executives flagged a technology inflection point and urged AI-based R&D. Equipment makers showcased next-generation inspection and bonding technologies.
Industry
Justem unveils new humidity-control product JDS at Semicon Korea
Justem will unveil its new JDS humidity-control solution at Semicon Korea 2026, to be held at Seoul’s COEX from Feb. 11 for three days. The company said JDS controls humidity and temperature in EFEM and FOUP environments and combines functions of its JFS and JDM systems. It aims to launch JDS in the second half of the year. Justem will also highlight JFS and introduce JPB.