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As AI chips grow, packaging substrates shift from round wafers to square panels

As AI chips grow in area, investment is starting at home and abroad to switch packaging bases from round wafers to large square substrates. Using square panels can process 5 to 6 times more chips at once than wafers, raising area utilisation to 87 percent from 57 percent. Competition is also intensifying between Taiwan and South Korean companies over panel-level packaging, a process that reassembles cut chips on a panel and builds moulding and redistribution layers.

Telecommunications & Media

Apple Watch Ultra 4, Series 12 set for September debut with internal upgrades

Apple is expected to unveil the Apple Watch Ultra 4 and Apple Watch Series 12 next month alongside a new iPhone, with upgrades centered on chip performance and health monitoring rather than major design changes. Reports cite long-awaited improvements in chips and speed, with talk of an S11 chip. Health features may expand, including more sensors and potential hypertension-related alerts, though specifications could change.

Telecommunications & Media

Apple Watch Ultra 4: Three key changes in focus ahead of release

Apple Watch Ultra 4 is expected to launch alongside devices such as the iPhone 18 Pro and iPhone Ultra. IT outlet 9to5Mac listed a new chip tailored for Siri AI, strengthened health sensors and improved power efficiency as the next model’s key changes. Bloomberg’s Mark Gurman said Ultra 4 and Series 12 would benefit from long-awaited chip and speed gains, with an S11 chip seen as likely. Reports also flag possible sensor upgrades and better battery performance.