Industry
Chipmetrics targets South Korea as 3D NAND heads toward 1,000 layers
Finnish semiconductor metrology startup Chipmetrics is targeting South Korea as 3D NAND stacking moves beyond 300 layers toward 1,000. It aims to measure thin-film quality inside deep, narrow holes with a method it says is hundreds of times faster than conventional cross-section TEM analysis. CEO Mikko Utriainen said precise measurement will be key as aspect ratios rise. CTO Feng Gao said fabs often measure only planar uniformity, not conformality in 3D structures.
