Industry
AI chips faster but cooler as semiconductor makers race to commercialise glass substrates
Glass is emerging as a key material for AI chips as semiconductor companies pursue next-generation packaging that could address power use and performance limits in AI data centres. SKC\'s U.S. unit Absolics is preparing commercial production and plans small-batch output from this year. Intel is also researching glass substrates. Advocates cite improved thermal stability, smoother surfaces and higher interconnect density, while challenges include fragility during manufacturing.
