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AI & Enterprise

U.S. chip industry may face 157,000 worker shortfall by 2030, Samsung deploys Korean staff

The U.S. semiconductor industry could face a workforce shortfall of up to 157,000 people by 2030 as it expands production of AI chips, a forecast said. The supply of engineers and skilled technicians is failing to keep pace with factory buildouts, intensifying competition among major chipmakers. Samsung Electronics and SK hynix are temporarily deploying Korean staff for initial operations, while U.S. universities and federal programs expand semiconductor training.

Industry

AMAT says AI chip performance hinges on data movement, solution is 3D scaling

Applied Materials says efficiency in moving data, rather than computing speed, is the main bottleneck for AI semiconductor performance and that the industry solution is 3D scaling. It described 3D scaling across logic, memory and packaging, and said capacity expansion should accompany demand. The company detailed approaches for DRAM, a shift in HBM stacking from micro-bumps to hybrid bonding, and panel interposer development, while highlighting cooperation with Samsung Electronics and SK Hynix in Korea.

Industry

Absolics decides 401.1 billion won rights issue to commercialise glass substrates

Competition to commercialise semiconductor substrates made of glass has entered a fundraising phase. SKC said its glass-substrate venture Absolics decided on a 401.1 billion won shareholder-allocated rights issue. Absolics plans to use the funds for glass-substrate evaluation and customer certification, and to improve yields and quality through equipment upgrades. Development is proceeding on embedding and non-embedding products. Additional investment will be executed in line with customer evaluations and milestone targets.