Qualcomm Technologies has signed a comprehensive agreement with Hyundai Mobis to jointly develop next-generation solutions for software-defined vehicles (SDVs) and advanced driver assistance systems (ADAS). The companies signed a memorandum of understanding on Jan. 7 local time at the Hyundai Mobis booth during CES 2026 in Las Vegas.

Hyundai Mobis Vice President Sookyung Jung, head of the In-Vehicle Electronics Business Unit, and Nakul Duggal, Qualcomm senior vice president and head of automotive, industrial and embedded IoT, and robotics, attended the signing.

The two companies will combine Hyundai Mobis' expertise in system integration, sensor fusion and perception with Qualcomm's leadership in system-on-chip (SoC) technology. The first project is the joint development of driving and parking solutions based on the Snapdragon Ride Flex SoC.

The companies will jointly develop integrated solutions optimized for emerging markets and also pursue expanded global supply opportunities. Emerging markets such as India are a key target, as ADAS adoption expands across vehicle segments and demand rises for SDV-ready architectures. Hyundai Mobis will use the Snapdragon Ride Flex SoC to strengthen ADAS performance, efficiency and stability.

The companies will also develop next-generation integrated solutions for future SDV applications by combining Hyundai Mobis' standardized software platform with Qualcomm's Snapdragon automotive technology. They plan to expand the scope of cooperation beyond ADAS to broader SDV implementation.