Hanamicron said on Wednesday it was named Semiconductor Review magazine's 2026 Asia Semiconductor Back-End Solutions Company of the Year.

Semiconductor Review selects companies each year following an assessment by a panel comprising corporate executives, industry experts and the editorial board. The company stressed it was recognised for customer-tailored joint engineering and full turnkey solution capabilities.

Hanamicron secured trust through a joint engineering model that takes part from the early stages of customer projects. The outlet analysed that the company is expanding from its foothold in memory packaging into non-memory and high-performance computing (HPC) fields. It cited full turnkey solutions covering the entire back-end process, from wafer testing to packaging, final testing and module assembly, as a differentiator.

The company has next-generation 2.5D/3D packaging technology called HIC. HIC is a proprietary technology that enables high-performance computing and chiplet-based high-density system integration. The technology was selected among the top 20 outstanding papers at the 2025 Electronic Components and Technology Conference (ECTC) with global leading companies. It also drew attention for combining technology, scale and localisation efficiency through stabilisation of its Vietnam unit.

The company plans to strengthen its status as a back-end specialist through proactive research and development investment and customer-tailored solutions. A Hanamicron official said, "This selection is the result of our role being recognised in the global market as a solution provider, not just a simple supplier."