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Industry

Samsung Electro-Mechanics signs 290 billion won AI server parts supply deal

Samsung Electro-Mechanics said on Sept. 29 it agreed to supply MLCCs and inductors worth about 290 billion won ($210 million) to a large global company. It said the one-year supply period runs from Jan. 1, 2027 to Dec. 31, 2027. The company said demand for high-capacity, high-reliability MLCCs and high-current, high-efficiency inductors is rising for AI servers and data centres.

Industry

TI aims to push power density limits for AI data centres

Texas Instruments unveiled next-generation insulated power modules targeting data centres and the electric vehicle market. It applied its in-house IsoShield multi-chip packaging to raise power density by up to three times versus existing solutions and cut solution size by up to 70 percent. At a media briefing, TI introduced the UCC34141 and UCC14240. TI highlighted IsoShield and MagPack technologies and said the approach reduces component count and design risk.