Industry
China\'s top 3 semiconductor packaging firms see profit surge in H1, launch 15 billion yuan expansion race
China’s three largest semiconductor packaging and testing (OSAT) companies have launched an expansion race as demand for AI semiconductors surges and profits grow at triple-digit rates. Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Huatian Technology together announced more than 15 billion yuan ($2.2 billion) in first-half capacity expansion plans, focused on advanced packaging for AI accelerators. Other firms and Taiwan’s ASE also increased investment plans.
