Industry
JNTC steps up global supply chain for TGV glass substrates
JNTC, which is seeking to take an early lead in the glass substrate market, has built a commercialisation cooperation framework with Japanese semiconductor packaging company TOPPAN. The company said it signed an agreement to commercialise TGV glass substrates, a technology that drills holes in glass substrates to pass electrical signals for next-generation semiconductor packaging. JNTC said the deal follows its recent development of TGV glass substrates across 0.3 mm to 2.0 mm thicknesses and supports broader supply-chain expansion.
