Industry
MSIT steps up training for advanced packaging talent in AI semiconductors
South Korea’s Ministry of Science and ICT said on Feb. 10 it will push ahead with training specialised talent in advanced semiconductor packaging, a key AI chip technology, in connection with upgrading national infrastructure. A public semiconductor fab and the Korea Microelectronics and Packaging Society signed an MOU in Seoul. The ministry said it has backed equipment and technology since 2024 with 49.5 billion won and plans to produce 80 job-ready trainees a year.
