Search results for JNTC
Industry
JNTC steps up global supply chain for TGV glass substrates
JNTC, which is seeking to take an early lead in the glass substrate market, has built a commercialisation cooperation framework with Japanese semiconductor packaging company TOPPAN. The company said it signed an agreement to commercialise TGV glass substrates, a technology that drills holes in glass substrates to pass electrical signals for next-generation semiconductor packaging. JNTC said the deal follows its recent development of TGV glass substrates across 0.3 mm to 2.0 mm thicknesses and supports broader supply-chain expansion.
Industry
JNTC secures full TGV glass substrate lineup from 0.3 mm to 2.0 mm thickness
JNTC is expanding its global supply chain in the semiconductor packaging glass substrate market by competing on thickness. The company said it developed the world’s first 2.0 mm thick TGV glass substrate and now has a full lineup from 0.3 mm to 2.0 mm. It said verification is complete with Taiwan and South Korean substrate makers, while testing is under way with a Japanese maker.
Industry
AI chips faster but cooler as semiconductor makers race to commercialise glass substrates
Glass is emerging as a key material for AI chips as semiconductor companies pursue next-generation packaging that could address power use and performance limits in AI data centres. SKC\'s U.S. unit Absolics is preparing commercial production and plans small-batch output from this year. Intel is also researching glass substrates. Advocates cite improved thermal stability, smoother surfaces and higher interconnect density, while challenges include fragility during manufacturing.
