AI chip company Rebellion unveiled its second-generation product, Rebel Quad, at a semiconductor conference. Rebellion said on Feb. 19 it presented a paper on the Rebel Quad architecture and conducted a real-time demonstration at the 2026 International Solid-State Circuits Conference (ISSCC) held in the United States. ISSCC is the world’s most prestigious semiconductor design conference and is known as the “Semiconductor Olympics.”

Rabel Quad is a next-generation AI chip that applies a chiplet process. To overcome a physical limit in semiconductor chip manufacturing, a critical limit of 858 sq mm, Rebellion adopted a design that connects 4 chiplets into 1. It resolved the low-yield problem that arises when producing a single large chip and improved production efficiency. The chiplet process makes small semiconductor dies with different functions separately and then integrates them like a single chip using advanced packaging technology.

Rebellion presented in a processor session that included global semiconductor companies such as IBM and MediaTek, and conducted a live demonstration of the physical Rebel Quad at the conference venue. The company stressed that it proved a level of completeness comparable to a mass-produced product by controlling variables that could arise in running an actual system, rather than simply presenting figures on paper.

Jinwook Oh (오진욱), Rebellion’s CTO, said, “Presenting a paper at ISSCC and showcasing a real-time demo means Rebel Quad has secured completeness as a product nearing commercialization beyond the laboratory level.” He said, “Based on the global-level technical trust secured through this presentation, we will speed up ongoing mass production and global customer PoCs and showcase South Korea’s AI semiconductor capabilities on the world stage.”