Koh Young Technology is moving to expand in Taiwan’s semiconductor market on the back of 3D precision measurement technology. Koh Young, as the company is known, said on Sept. 7 it is strengthening its semiconductor inspection business in step with the expansion of the AI and high performance computing market.

Koh Young participated in SEMICON Taiwan 2026, held in Taipei from Sept. 2 to 4, and showcased semiconductor inspection technologies and solutions based on 3D precision measurement. Centering on the Meister series, it unveiled a 3D inspection solution for transparent materials, for which demand is rising in advanced packaging processes, and a fine bump inspection solution for wafer-level packaging. During the event, it also demonstrated precision measurement technology using actual semiconductor components for booth visitors.

The Meister series is an inspection platform that applies Koh Young’s accumulated 3D precision measurement technology in the electronics manufacturing industry to semiconductor back-end processes. In advanced packaging processes, where miniaturisation and high integration are advancing rapidly, it can precisely measure bump and chip height and shape in 3D and use the results for process quality control.

The 3D inspection solutions are being applied across various semiconductor packaging processes. The company is also expanding their application to inspection of optical communications components, where demand is growing due to the expansion of the AI and high performance computing market. As semiconductor packaging processes become more highly integrated and precise and the importance of precision measurement grows, the company stressed that it is expanding its presence in the semiconductor inspection market based on its accumulated 3D inspection technology.

A Koh Young official said, "As the AI and HPC markets grow, semiconductor packaging is becoming more complex and precise, increasing the importance of precision inspection technologies such as quantitative 3D measurement of fine bumps and thickness measurement of transparent materials." The official added, "Through this exhibition, we were able to confirm Taiwanese customers’ strong interest in advanced 3D inspection solutions."

The official added, "Koh Young plans to continue expanding its business areas into inspection fields related to AI infrastructure, including advanced packaging, optical communications components and SOCAMM, based on its proprietary 3D measurement technology and global customer base."