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Industry
JNTC steps up global supply chain for TGV glass substrates
JNTC, which is seeking to take an early lead in the glass substrate market, has built a commercialisation cooperation framework with Japanese semiconductor packaging company TOPPAN. The company said it signed an agreement to commercialise TGV glass substrates, a technology that drills holes in glass substrates to pass electrical signals for next-generation semiconductor packaging. JNTC said the deal follows its recent development of TGV glass substrates across 0.3 mm to 2.0 mm thicknesses and supports broader supply-chain expansion.
Industry
JNTC secures full TGV glass substrate lineup from 0.3 mm to 2.0 mm thickness
JNTC is expanding its global supply chain in the semiconductor packaging glass substrate market by competing on thickness. The company said it developed the world’s first 2.0 mm thick TGV glass substrate and now has a full lineup from 0.3 mm to 2.0 mm. It said verification is complete with Taiwan and South Korean substrate makers, while testing is under way with a Japanese maker.
Industry
JNTC says it is discussing commercialisation timeline for semiconductor glass substrates
JNTC said it is discussing the timing of commercialisation for semiconductor glass substrates. The company said it shared progress on its TGV glass-substrate business at NH Investment & Securities\' NHIS Korea Corporate Day 2026 and is holding relay meetings with global institutional investors in Hong Kong and Singapore. JNTC said it completed initial quality tests with 16 global customers, increased investment at its Vietnam unit and expects demand to rise in semiconductor packaging.