Search results for Semicon Taiwan 2026
Industry
As AI chips grow, packaging substrates shift from round wafers to square panels
As AI chips grow in area, investment is starting at home and abroad to switch packaging bases from round wafers to large square substrates. Using square panels can process 5 to 6 times more chips at once than wafers, raising area utilisation to 87 percent from 57 percent. Competition is also intensifying between Taiwan and South Korean companies over panel-level packaging, a process that reassembles cut chips on a panel and builds moulding and redistribution layers.
Industry
Taiwan-led semiconductor security standard SEMI E187 launches, first certified products due this year
The certification mark for the semiconductor cybersecurity standard SEMI E187 has been unveiled, moving the certification system from drafting to verification. Taiwan\'s Ministry of Digital Affairs and SEMI revealed the mark at a security forum during Semicon Taiwan 2026. Taiwan expects the Taipei Computer Association to become the first verification body accredited by the Taiwan Accreditation Foundation as early as October. A first product could obtain the mark before year-end.
Industry
Koh Young Technology targets AI, HPC 3D semiconductor inspection market
Koh Young Technology is stepping up efforts to expand in Taiwan’s semiconductor market by leveraging 3D precision measurement technology. The company said on Sept. 7 it is strengthening its semiconductor inspection business in line with growth in AI and high performance computing. At SEMICON Taiwan 2026 in Taipei, it showcased the Meister series and introduced 3D inspection solutions for transparent materials and fine bump inspection for wafer-level packaging.
