Industry
Hanwha Semitec completes development of second-generation hybrid bonder
Hanwha Semitec has developed a second-generation hybrid bonder and plans to deliver the SHB2 Nano to customers in the first half of this year for performance testing, the company said on Tuesday. The equipment directly bonds chips on copper surfaces and is seen as a next-generation technology for boosting performance and productivity of high-bandwidth memory for AI semiconductors. Hanwha Semitec also aims to strengthen its position in the TC bonder market and is developing a second-generation TC bonder.
