Industry
SK hynix unveils CPO technology to break memory bandwidth barrier
SK hynix presented a technology aimed at easing a new bottleneck in AI infrastructure in a paper published in the journal Nature Electronics. The company said ultra-large clusters linking thousands of GPUs and HBM are creating a bandwidth barrier that limits data movement between systems. The paper outlines a roadmap for co-packaged optics, with targets including more than 100 Tb/s per node and less than 1 pJ/bit energy use.
