Industry
Applied Materials, Intel to cooperate on transistor, interconnect and packaging at EPIC Center
Applied Materials and Intel agreed to work together to speed development and commercialization of AI semiconductor manufacturing technologies. The companies will link Applied’s EPIC Center in Silicon Valley with Intel’s R&D campus in Hillsboro, Oregon, to shorten the time from development to commercialization. Cooperation covers next-generation materials, process technologies and device structures for advanced logic nodes, spanning FEOL and BEOL, including interconnect scaling and Foveros-based advanced packaging.
