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AI & Enterprise

Epson and NexPot Solution team up to expand anti-counterfeit security label market

Korea Epson said on Aug. 3 it signed a memorandum of understanding with security solutions company NexPot Solution to expand the anti-counterfeit security label market and develop high value-added label solutions. The companies plan to combine Epson\'s SurePress L-6534VW with NexPot Solution\'s security technology to broaden security label offerings. They aim to expand new solutions that merge QR-based authentication with special printing techniques such as digital varnish.

Industry

Korean HBM equipment makers target Japan\'s semiconductor market

Japan\'s Rapidus is expected to place equipment orders ahead of the April start-up of its back-end R&D centre in Hokkaido. The centre will focus on chiplet-based advanced packaging such as FC-BGA, silicon interposers and hybrid bonding. The article says Japan is strong in front-end tools but lacks a robust back-end equipment ecosystem for HBM and 2.5D packaging, creating opportunities for Korean suppliers. It cites recent supply deals by Hanmi Semiconductor and Hanwha Semitec with SK Hynix.